This brand-new chipset is here to support fast 5G connectivity at home, business and everywhere. This highly integrated 7nm compact chip design features an embedded 5G radio and a four-core Arm CPU. The MediaTek T750 is fully featured with all the functions and peripherals essential for device makers to create high-performance CPE products with the smallest form factor. Currently, the MediaTek T750 chipset has begun to be tested by potential customers. “High-speed broadband connectivity is becoming more and more important with more and more connected devices, and more people are working from home, taking online classes and using services such as telehealth and video calling,” said JC Hsu, Corporate Vice. President / General Manager of MediaTek’s Wireless Communications Business Unit, in a press release to INILAHCOM. “We are affirming our 5G leadership beyond the smartphone segment with the T750 chipset, opening up new market opportunities for broadband operators and device makers, and helping consumers, wherever they are, to experience all the benefits of 5G connectivity,” he continued… A 5G router with support for sub-6GHz frequencies provides an affordable broadband alternative to areas with limited DSL, cable, or fibre service. Having access to super-fast connectivity will also be a game-changer for suburban, rural and underdeveloped areas that currently lack adequate wireless service and signal. Analyst firm IDC predicts the global 5G and LTE router and gateway market will expand from an estimated US $979 million in 2019 to nearly US $3 billion in 2024. Counterpoint Research also projects that FWA 5G will grow from 10.3 million subscribers in 2020 to more than 450 million subscribers in 2030. The MediaTek T750 chipset supports 5G sub-6GHz and 2CC CA (two-component carrier aggregation) for wider coverage, making it ideal for indoor and outdoor FWA products, such as home routers, as well as mobile hotspots. Additionally, the MediaTek T750 design, which includes a 5G NR FR1 modem, a four-core Arm Cortex-A55 processor, and all the peripherals required on a single chip, offers performance and time-to-market advantages that accelerate development times. ODM / OEM. Devices based on the T750 are expected in the second quarter of 2021, likely following the release of Intel- and MediaTek 5G-powered laptop PCs from HP and Dell early next year.
